Up to 32 layers, 2.5/2.5 mil trace/space, 0.4 mm BGA pitch, 56 Gbps differential signalling, board-level EMC and DFX review.
2–30 layers, FR-4 and aluminium substrate, 4/4 mil minimum trace, 0.2 mm minimum hole, 0.4–3.0 mm thickness, UL and RoHS certified.
Down to 0201 parts, 0.3 mm BGA and 0.35 mm WLCSP, ±0.03 mm placement accuracy, IPC Class 2, AOI 100% and X-Ray inspection.
SMT + DIP + wave soldering + final assembly + IC programming + functional test, consignment or full turnkey with component sourcing.
100% purchased to your BOM brand and part number through franchised distributors, with incoming QC and climate-controlled ESD-safe warehousing.
Custom FCT fixtures built from your test points and test plan, ICT, IC programming, AOI and X-Ray inspection with data-based judgement.
Fully automated spray line with curing oven, double-sided coating and baking, selective masking of connectors, antennas and heat sinks.
Manufacturability review against our real equipment capability before production: layer stack, panelisation, BOM-to-footprint matching, testability.
| Quality class | IPC Class 2 |
|---|---|
| Minimum order | No MOQ — 1 piece accepted |
| Lead time | Fastest 24 hours |
| Placement capacity | 5,000,000 placements per day |
| Placement accuracy | ±0.03 mm |
| Component types | BGA, WLCSP, QFN, PoP, connectors, wires/cables |
| Smallest lead pitch | BGA 0.3 mm / WLCSP 0.35 mm |
| Smallest component | 0201 |
| Max. component height | 25 mm |
| PCB size | Min. 50 × 40 mm, max. 510 × 340 mm |
| PCB types | Rigid FR-4, flex and rigid-flex, aluminium, HASL / ENIG / immersion silver |
| Soldering | Lead-free reflow, lead-free wave, selective wave, hand soldering |
| Stencil | Laser-cut stainless steel |
| Inspection | SPI, 3D AOI (100%), X-Ray, first-article inspection |
| Other processes | Conformal coating, final assembly, IC programming, functional test, DFM |
| Layers | 2 – 30 |
|---|---|
| Base material | FR-4 rigid, aluminium substrate (halogen-free available) |
| Max. panel size | 680 × 1200 mm (2-layer); 680 × 640 mm (4–6 layer) |
| Board thickness | 0.4 – 3.0 mm |
| Min. trace / space | 4 / 4 mil (0.1 mm) |
| Min. hole | 0.2 mm |
| Finished copper | 35 / 70 / 105 µm (1 / 2 / 3 oz) |
| Profile tolerance | ±0.15 mm |
| Solder mask colours | Green, red, blue, white, black, purple and others |
| Certifications | UL (US), RoHS (EU) |
Gerber files, BOM and pick-and-place data are enough to start. Schematics, assembly drawings and a test plan help us give a more accurate answer.
We check the stack-up, panelisation, BOM-to-footprint matching, stencil design and testability against our actual equipment, then report back with a manufacturability assessment.
Quotation within 24 hours, production once approved, and inspection at every stage — SPI, 3D AOI, X-Ray and functional test — before packing and shipping.
There is no MOQ. We accept orders from a single piece, which is the core of our positioning in prototype, NPI and low-to-mid volume manufacturing.
The fastest turnaround is 24 hours, depending on process complexity and current scheduling. A firm lead time is confirmed after engineering review.
Yes. Send us your Gerber files, BOM and pick-and-place data, and we can source components, fabricate the PCB, assemble, program, test, coat and ship a finished board.
IATF 16949:2016 for automotive, ISO 9001:2015 for general quality management and ISO 13485:2016 for medical devices. Our PCB products are also UL and RoHS certified.
Email your Gerber files, BOM and quantity requirements to sales@abp.net.cn. Quotations are typically returned within 24 hours.
Yes. We ship to customers in North America, Europe and Asia, and have exhibited at electronica Munich, Global Sources Hong Kong and CMEF. Export documentation can be provided.
Quotations typically within 24 hours. Email sales@abp.net.cn.