Manufacturing Capability

直接回答：Yingchuangli operates five fully automated high-speed SMT lines and four post-soldering lines across two plants, achieving 5 million placements per day at ±0.03 mm accuracy. We place components down to 0201 with BGA pitches of 0.3 mm, handle PCBs from 50 × 40 mm to 510 × 340 mm in 2 to 30 layers, and build to IPC Class 2. Inspection includes SPI solder paste measurement, 3D AOI on 100% of boards, X-Ray for hidden joints, first-article inspection and custom FCT functional testing.

Key manufacturing parameters
SMT lines	5 fully automated high-speed lines
Post-soldering lines	4 lines with wave and selective soldering
Placement capacity	5 million placements per day
Placement accuracy	±0.03 mm
Smallest component	0201 (BGA 0.3 mm / WLCSP 0.35 mm)
PCB size range	50 × 40 mm up to 510 × 340 mm
PCB layers	2 – 30 layers (incl. HDI, FPC, metal core)
Copper thickness	35 / 70 / 105 µm (1 / 2 / 3 oz)
Min. trace / space	4 / 4 mil (0.1 mm)
Quality class	IPC Class 2
Minimum order	No MOQ — 1 piece accepted
Fastest lead time	24 hours

Quality gates

Four measurable checkpoints — no go/no-go by eye.

SPI solder paste inspection

Volume and height verified after printing, before reflow.

10-zone reflow

Profiles tuned per board, including thick-copper and mixed-technology assemblies.

3D AOI (100%)

Height, offset and polarity checked with 3D imaging on every board.

X-Ray inspection

Hidden joints under BGA and QFN imaged internally.

Equipment by process

贴片

High-speed SMT Line

贴装 0201 至大型连接器，日均 500 万点

Auto Loader

无人工干预的连续上板

Solder Paste Printer

锡膏印刷，直接决定焊接质量起点

10-Zone Reflow Oven

无铅回流焊接，温区曲线可按板调味

检测

SPI

印刷后锡膏厚度与体积检测

3D AOI

贴装后 100% 光学检测

X-Ray Inspection

BGA、QFN 等隐藏焊点内部成像检查

First Article Inspection

首件确认，量产前锁定工艺参数

后焊

Wave Soldering

DIP 插件批量焊接

Selective Soldering

局部焊接，保护邻近元件

涂覆

Auto Conformal Coating Line

涂覆机 + 固化炉，双面喷涂与烘烤

组装

Laser Marker

板面追溯码 / 序列号打标

测试

FCT Fixture & Tester

按客户测试方案开治具做整板功能验证